Best Paper Award
DAO HUA ZHANG — Shenzhen Pinghu Laboratory
DAO HUA ZHANG of Shenzhen Pinghu Laboratory, China, is recognized with the Best Paper Award for research in Engineering. His recognized paper, “Low-Resistivity Au-Free Ohmic Contacts for Diamond,” focuses on the development of low-resistivity, gold-free ohmic contacts for diamond-based electronic and semiconductor applications.[1]
Abstract
This article recognizes DAO HUA ZHANG with the Best Paper Award for research in Engineering. The recognized study investigates Au-free ohmic contacts for diamond and reports a Ti/Al/Ti/TiN multilayer metal structure. The optimized contact achieved a specific ohmic contact resistance of 3.9 × 10−5 Ω·cm2, while a diamond Schottky barrier diode fabricated using the optimized contact demonstrated a breakdown voltage of 1770 V.[1]
Keywords
Best Paper Award, DAO HUA ZHANG, Engineering, Low-Resistivity Ohmic Contacts, Au-Free Ohmic Contacts, Diamond Electronics, Diamond Semiconductor, Ti/Al/Ti/TiN, Schottky Barrier Diodes, Semiconductor Engineering, Electrical Contacts, Advanced Materials, Diamond Technology, Power Electronics.[1]
Introduction
Diamond is an important material for advanced semiconductor and electronic applications because of its distinctive electrical and thermal properties. The development of reliable, low-resistance electrical contacts is an important engineering consideration for the practical implementation of diamond-based devices. The recognized study investigates Au-free ohmic contact technology as an approach for improving electrical interfaces in diamond semiconductor devices.[1]
Research Profile
DAO HUA ZHANG is affiliated with Shenzhen Pinghu Laboratory in China and works within the field of Engineering. The supplied Scopus profile records 413 documents, 6,408 citations, and an h-index of 41. His ORCID identifier is 0000-0002-5853-254X, providing a persistent identifier for his scholarly research record.[2]
Research Contributions
The recognized paper develops an Au-free ohmic contact using a Ti/Al/Ti/TiN multilayer structure. The published research reports that the optimized contact achieved a specific ohmic contact resistance of 3.9 × 10−5 Ω·cm2. The study also examines the metal-diamond interface and investigates the relationship between the multilayer structure, annealing conditions, and contact performance.[1]
Publication
The principal publication associated with this award profile is “Low-Resistivity Au-Free Ohmic Contacts for Diamond.” The article was authored by Tianhe Mi, Peng Wang, Senchuan Ding, Meixue Zong, Haolin Hu, and Dao Hua Zhang and published in Electronics Letters. The DOI assigned to the article is 10.1049/ell2.70574.[1]
Research Impact
The research is relevant to the development of diamond-based electronic devices where low-resistance electrical contacts are required. The reported Au-free contact structure provides an approach for investigating electrical interfaces without relying on gold-containing contact layers.[1]
Award Recognition
DAO HUA ZHANG is recognized with the Best Paper Award in Engineering for the research contribution represented by “Low-Resistivity Au-Free Ohmic Contacts for Diamond.” The recognized work addresses electrical contact technology for diamond semiconductor applications and presents experimentally reported results for an Au-free ohmic contact structure.[1]
Conclusion
DAO HUA ZHANG of Shenzhen Pinghu Laboratory, China, is recognized with the Best Paper Award for research in Engineering. His recognized paper investigates low-resistivity Au-free ohmic contacts for diamond using a Ti/Al/Ti/TiN multilayer structure. The study reports a specific contact resistance of 3.9 × 10−5 Ω·cm2 and a diamond Schottky barrier diode breakdown voltage of 1770 V.[1]
External Links
References
- Mi, T., Wang, P., Ding, S., Zong, M., Hu, H., & Zhang, D. H. (2026).
Low-Resistivity Au-Free Ohmic Contacts for Diamond.
https://doi.org/10.1049/ell2.70574
- Scopus. (n.d.).Scopus Author Profile: DAO HUA ZHANG.
https://www.scopus.com/authid/detail.uri?authorId=7405357983
- ORCID. (n.d.).ORCID Profile: DAO HUA ZHANG.
https://orcid.org/0000-0002-5853-254X
- Best Paper Awards. (n.d.)
https://bestpaperawards.com/